NordPac is the annual IMAPS Nordic conference on microelectronics packaging, now in its 62nd edition. The 2026 programme covers packaging, integration, reliability, PCB design and the application of AI and IoT in electronics, with sessions including keynotes, a panel discussion, workshops and a boat tour dinner on 10 June.
Who should attend?
The conference is aimed at researchers, engineers and industry professionals working in microelectronics packaging, integration and electronics manufacturing.
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